IDT79RV5000267BS272
vs
MPC5200VR400B
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
FREESCALE SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
LBGA,
27 X 27 MM, 1.27 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-272
Pin Count
272
272
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
64
32
Bit Size
64
32
Boundary Scan
YES
YES
Clock Frequency-Max
125 MHz
66 MHz
External Data Bus Width
64
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
NO
YES
JESD-30 Code
S-PBGA-B272
S-PBGA-B272
JESD-609 Code
e0
e1
Length
29 mm
27 mm
Low Power Mode
YES
YES
Number of Terminals
272
272
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.65 mm
2.65 mm
Speed
267 MHz
400 MHz
Supply Voltage-Max
3.465 V
1.58 V
Supply Voltage-Min
3.135 V
1.42 V
Supply Voltage-Nom
3.3 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
COMMERCIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
29 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR
Base Number Matches
1
2
Pbfree Code
Rohs Code
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
Moisture Sensitivity Level
3
Package Equivalence Code
BGA272,20X20,50
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
40
Compare IDT79RV5000267BS272 with alternatives
Compare MPC5200VR400B with alternatives