IDT79RC64V74-180DPI
vs
IMST900-F20S
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
STMICROELECTRONICS
|
Part Package Code |
QFP
|
QFP
|
Package Description |
FQFP,
|
CERAMIC, LCC-208
|
Pin Count |
208
|
208
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
3A991.A.2
|
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
64
|
|
Bit Size |
64
|
32
|
Boundary Scan |
YES
|
|
Clock Frequency-Max |
180 MHz
|
|
External Data Bus Width |
64
|
|
Format |
FLOATING POINT
|
|
Integrated Cache |
YES
|
|
JESD-30 Code |
S-PQFP-G208
|
S-CQFP-G208
|
JESD-609 Code |
e0
|
e0
|
Length |
28 mm
|
28 mm
|
Low Power Mode |
YES
|
|
Number of Terminals |
208
|
208
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
FQFP
|
FQFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, FINE PITCH
|
FLATPACK, FINE PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.1 mm
|
3.5 mm
|
Speed |
180 MHz
|
20 MHz
|
Supply Voltage-Max |
3.465 V
|
|
Supply Voltage-Min |
3.135 V
|
|
Supply Voltage-Nom |
3.3 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
28 mm
|
28 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR
|
Base Number Matches |
1
|
1
|
Package Equivalence Code |
|
QFP208,1.2SQ,20
|
|
|
|
Compare IDT79RC64V74-180DPI with alternatives
Compare IMST900-F20S with alternatives