IDT79RC64V475-180DZI
vs
MC68330CFG16
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
MOTOROLA INC
|
| Part Package Code |
QFP
|
|
| Package Description |
QFP,
|
PLASTIC, QFP-128
|
| Pin Count |
128
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
64
|
32
|
| Bit Size |
64
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
90 MHz
|
16.78 MHz
|
| External Data Bus Width |
64
|
16
|
| Format |
FLOATING POINT
|
FIXED POINT
|
| Integrated Cache |
YES
|
NO
|
| JESD-30 Code |
S-PQFP-G128
|
R-PQFP-G128
|
| JESD-609 Code |
e0
|
e0
|
| Low Power Mode |
YES
|
YES
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
128
|
128
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
FQFP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
FLATPACK, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Speed |
180 MHz
|
16.78 MHz
|
| Supply Voltage-Max |
3.465 V
|
5.25 V
|
| Supply Voltage-Min |
3.135 V
|
4.75 V
|
| Supply Voltage-Nom |
3.3 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
HCMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
QUAD
|
QUAD
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
4
|
| Length |
|
20 mm
|
| Package Equivalence Code |
|
QFP128,.68X.85,20
|
| Seated Height-Max |
|
3.4 mm
|
| Terminal Pitch |
|
0.5 mm
|
| Width |
|
14 mm
|
|
|
|
Compare IDT79RC64V475-180DZI with alternatives
Compare MC68330CFG16 with alternatives