IDT79R3081E-40DL vs 79R308125MJB feature comparison

IDT79R3081E-40DL Integrated Device Technology Inc

Buy Now Datasheet

79R308125MJB Integrated Device Technology Inc

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code LCC QFN
Package Description HQCCJ, LDCC84,1.2SQ QCCJ, LDCC84,1.2SQ
Pin Count 84 84
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan NO NO
Clock Frequency-Max 80 MHz 50 MHz
External Data Bus Width 32 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PQCC-J84 S-PQCC-J84
JESD-609 Code e0 e0
Length 29.3116 mm 29.083 mm
Low Power Mode NO YES
Number of Terminals 84 84
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HQCCJ QCCJ
Package Equivalence Code LDCC84,1.2SQ LDCC84,1.2SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG CHIP CARRIER
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 4.572 mm
Speed 40 MHz 25 MHz
Supply Current-Max 700 mA 650 mA
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER MILITARY
Terminal Finish TIN LEAD Tin/Lead (Sn85Pb15)
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Width 29.3116 mm 29.083 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Pbfree Code No
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 225
Screening Level MIL-STD-883 Class B
Time@Peak Reflow Temperature-Max (s) 30

Compare IDT79R3081E-40DL with alternatives

Compare 79R308125MJB with alternatives