IDT79R3052-33DL
vs
IDT79R3051E-33DL
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
LCC
|
LCC
|
| Package Description |
HQCCJ, LDCC84,1.2SQ
|
HQCCJ, LDCC84,1.2SQ
|
| Pin Count |
84
|
84
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
66.67 MHz
|
66.67 MHz
|
| External Data Bus Width |
32
|
32
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PQCC-J84
|
S-PQCC-J84
|
| JESD-609 Code |
e0
|
e0
|
| Length |
29.3116 mm
|
29.3116 mm
|
| Low Power Mode |
NO
|
NO
|
| Number of Terminals |
84
|
84
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HQCCJ
|
HQCCJ
|
| Package Equivalence Code |
LDCC84,1.2SQ
|
LDCC84,1.2SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG
|
CHIP CARRIER, HEAT SINK/SLUG
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
4.57 mm
|
| Speed |
33.33 MHz
|
33.33 MHz
|
| Supply Current-Max |
450 mA
|
450 mA
|
| Supply Voltage-Max |
5.25 V
|
5.25 V
|
| Supply Voltage-Min |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
29.3116 mm
|
29.3116 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
|
|
|
Compare IDT79R3052-33DL with alternatives
Compare IDT79R3051E-33DL with alternatives