IDT79R3052-20MJ
vs
79RV3081E33MJM
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFN
QFN
Package Description
QCCJ, LDCC84,1.2SQ
QCCJ, LDCC84,1.2SQ
Pin Count
84
84
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
BURST BUS; 5 PIPELINE STAGES
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
NO
NO
Clock Frequency-Max
40 MHz
50 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FLOATING POINT
Integrated Cache
NO
YES
JESD-30 Code
S-PQCC-J84
S-PQCC-J84
JESD-609 Code
e0
e0
Length
29.083 mm
29.083 mm
Low Power Mode
NO
YES
Moisture Sensitivity Level
1
1
Number of DMA Channels
Number of External Interrupts
6
Number of Serial I/Os
Number of Terminals
84
84
On Chip Data RAM Width
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Equivalence Code
LDCC84,1.2SQ
LDCC84,1.2SQ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Peak Reflow Temperature (Cel)
225
225
Qualification Status
Not Qualified
Not Qualified
RAM (words)
0
Seated Height-Max
4.57 mm
4.572 mm
Speed
20 MHz
33 MHz
Supply Current-Max
400 mA
525 mA
Supply Voltage-Max
5.25 V
3.465 V
Supply Voltage-Min
4.75 V
3.135 V
Supply Voltage-Nom
5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
MILITARY
Terminal Finish
TIN LEAD
Tin/Lead (Sn85Pb15)
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Width
29.083 mm
29.083 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
2
Pbfree Code
Compare IDT79R3052-20MJ with alternatives
Compare 79RV3081E33MJM with alternatives