IDT79R3051E-33DL
vs
IDT79RV3081-33DL8
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
LCC
|
LCC
|
Package Description |
HQCCJ, LDCC84,1.2SQ
|
HQCCJ,
|
Pin Count |
84
|
84
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
32
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
NO
|
NO
|
Clock Frequency-Max |
66.67 MHz
|
66.67 MHz
|
External Data Bus Width |
32
|
32
|
Format |
FIXED POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PQCC-J84
|
S-PQCC-J84
|
JESD-609 Code |
e0
|
e0
|
Length |
29.3116 mm
|
29.3116 mm
|
Low Power Mode |
NO
|
NO
|
Number of Terminals |
84
|
84
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HQCCJ
|
HQCCJ
|
Package Equivalence Code |
LDCC84,1.2SQ
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG
|
CHIP CARRIER, HEAT SINK/SLUG
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
4.57 mm
|
Speed |
33.33 MHz
|
33.33 MHz
|
Supply Current-Max |
450 mA
|
|
Supply Voltage-Max |
5.25 V
|
3.465 V
|
Supply Voltage-Min |
4.75 V
|
3.135 V
|
Supply Voltage-Nom |
5 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
29.3116 mm
|
29.3116 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
1
|
|
|
|
Compare IDT79R3051E-33DL with alternatives
Compare IDT79RV3081-33DL8 with alternatives