IDT79R3010AE25QJM vs IDT79R3010AE25QJB feature comparison

IDT79R3010AE25QJM Integrated Device Technology Inc

Buy Now Datasheet

IDT79R3010AE25QJB Integrated Device Technology Inc

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFN QFN
Package Description CAVITY UP, CERPACK-84 CAVITY UP, CERPACK-84
Pin Count 84 84
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width
Barrel Shifter NO NO
Boundary Scan NO NO
Bus Compatibility R3000A; R3001 R3000A; R3001
Clock Frequency-Max 50 MHz 50 MHz
External Data Bus Width 32 32
JESD-30 Code S-GQCC-J84 S-GQCC-J84
JESD-609 Code e0 e0
Length 29.21 mm 29.21 mm
Moisture Sensitivity Level 1 1
Number of Terminals 84 84
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code QCCJ QCCJ
Package Equivalence Code LDCC84,1.2SQ LDCC84,1.2SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Peak Reflow Temperature (Cel) 225 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Current-Max 700 mA 700 mA
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 29.21 mm 29.21 mm
uPs/uCs/Peripheral ICs Type MATH PROCESSOR, FLOATING POINT ACCELERATOR MATH PROCESSOR, FLOATING POINT ACCELERATOR
Base Number Matches 1 1
Screening Level 38535Q/M;38534H;883B

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