Findchips: Compare IDT74SSTVN16859CNLG8 vs SSTV16859EC,557

IDT74SSTVN16859CNLG8 vs SSTV16859EC,557 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	No
Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	INTEGRATED DEVICE TECHNOLOGY INC	NXP SEMICONDUCTORS
Part Package Code	QFN	BGA
Package Description	GREEN, PLASTIC, VFQFN-56	LFBGA, BGA96,6X16,32
Pin Count	56	96
Reach Compliance Code	compliant	not_compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	SSTV	SSTV
JESD-30 Code	S-PQCC-N56	R-PBGA-B96
JESD-609 Code	e3	e0
Length	8 mm	13.5 mm
Logic IC Type	D FLIP-FLOP	D FLIP-FLOP
Number of Bits	13	13
Number of Functions	1	1
Number of Terminals	56	96
Operating Temperature-Max	70 °C	70 °C
Operating Temperature-Min
Output Polarity	TRUE	TRUE
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	HVQCCN	LFBGA
Package Shape	SQUARE	RECTANGULAR
Package Style	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	GRID ARRAY, LOW PROFILE, FINE PITCH
Propagation Delay (tpd)	2.2 ns	2.8 ns
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1 mm	1.5 mm
Supply Voltage-Max (Vsup)	2.7 V	2.7 V
Supply Voltage-Min (Vsup)	2.3 V	2.3 V
Supply Voltage-Nom (Vsup)	2.5 V	2.5 V
Surface Mount	YES	YES
Technology	TTL	CMOS
Temperature Grade	COMMERCIAL	COMMERCIAL
Terminal Finish	MATTE TIN	TIN LEAD
Terminal Form	NO LEAD	BALL
Terminal Pitch	0.5 mm	0.8 mm
Terminal Position	QUAD	BOTTOM
Trigger Type	POSITIVE EDGE	POSITIVE EDGE
Width	8 mm	5.5 mm
fmax-Min	220 MHz	200 MHz
Base Number Matches	1	1
Manufacturer Package Code		SOT536-1
Package Equivalence Code		BGA96,6X16,32
	Logic » FF/Latches	Logic » FF/Latches