IDT74SSTVN16859CNLG
vs
SSTV16859EC/G,518
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
QFN
|
BGA
|
| Package Description |
GREEN, PLASTIC, VFQFN-56
|
LFBGA,
|
| Pin Count |
56
|
96
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Family |
SSTV
|
SSTV
|
| JESD-30 Code |
S-PQCC-N56
|
R-PBGA-B96
|
| JESD-609 Code |
e3
|
|
| Length |
8 mm
|
13.5 mm
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Moisture Sensitivity Level |
3
|
|
| Number of Bits |
13
|
13
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
56
|
96
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
LFBGA
|
| Package Equivalence Code |
LCC56,.31SQ,20
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
2.2 ns
|
2.8 ns
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1 mm
|
1.5 mm
|
| Supply Voltage-Max (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Min (Vsup) |
2.3 V
|
2.3 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
TTL
|
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
8 mm
|
5.5 mm
|
| fmax-Min |
220 MHz
|
200 MHz
|
| Base Number Matches |
2
|
1
|
| Manufacturer Package Code |
|
SOT536-1
|
|
|
|
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