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IDT74SSTVF16859NL vs SSTVF16859BS,157 feature comparison

IDT74SSTVF16859NL Integrated Device Technology Inc

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SSTVF16859BS,157 NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC NXP SEMICONDUCTORS
Part Package Code QFN QFN
Package Description HVQCCN, LCC56,.31SQ,20 HVQCCN, LCC56,.31SQ,20
Pin Count 56 56
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family SSTV SSTV
JESD-30 Code S-PQCC-N56 S-PQCC-N56
JESD-609 Code e0 e4
Length 8 mm 8 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Moisture Sensitivity Level 3 1
Number of Bits 13 13
Number of Functions 1 1
Number of Terminals 56 56
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVQCCN HVQCCN
Package Equivalence Code LCC56,.31SQ,20 LCC56,.31SQ,20
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 240 260
Propagation Delay (tpd) 2.9 ns 2.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1 mm
Supply Voltage-Max (Vsup) 2.7 V 2.7 V
Supply Voltage-Min (Vsup) 2.3 V 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn85Pb15) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 8 mm 8 mm
fmax-Min 220 MHz 210 MHz
Base Number Matches 1 1
Logic » FF/Latches
Logic » FF/Latches

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