IDT74SSTV16859NL
vs
935271266157
feature comparison
All Stats
Differences Only
Rohs Code
No
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
NXP SEMICONDUCTORS
Part Package Code
QFN
QFN
Package Description
HVQCCN, LCC56,.31SQ,20
HVQCCN,
Pin Count
56
56
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
SSTV
JESD-30 Code
S-PQCC-N56
S-PQCC-N56
JESD-609 Code
e0
Length
8 mm
8 mm
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Moisture Sensitivity Level
3
Number of Bits
13
13
Number of Functions
1
1
Number of Terminals
56
56
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
HVQCCN
Package Equivalence Code
LCC56,.31SQ,20
LCC56,.31SQ,20
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
240
NOT SPECIFIED
Propagation Delay (tpd)
2.8 ns
2.8 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
1 mm
Supply Voltage-Max (Vsup)
2.7 V
2.7 V
Supply Voltage-Min (Vsup)
2.3 V
2.3 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
TTL
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn85Pb15)
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
8 mm
8 mm
fmax-Min
200 MHz
200 MHz
Base Number Matches
1
1
Compare IDT74SSTV16859NL with alternatives
Compare 935271266157 with alternatives