IDT74LVCH32373ABF vs SNJ54BCT541FK-00 feature comparison

IDT74LVCH32373ABF Integrated Device Technology Inc

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SNJ54BCT541FK-00 Texas Instruments

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC TEXAS INSTRUMENTS INC
Part Package Code BGA
Package Description LFBGA, BGA96,6X16,32 QCCN,
Pin Count 96
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z BCT/FBT
JESD-30 Code R-PBGA-B96 S-CQCC-N20
JESD-609 Code e0
Length 13.5 mm 8.89 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.024 A
Moisture Sensitivity Level 3
Number of Bits 8 8
Number of Functions 4 1
Number of Ports 2 2
Number of Terminals 96 20
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code LFBGA QCCN
Package Equivalence Code BGA96,6X16,32
Package Shape RECTANGULAR SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH CHIP CARRIER
Peak Reflow Temperature (Cel) 225
Prop. Delay@Nom-Sup 4.2 ns
Propagation Delay (tpd) 5.3 ns 8.7 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 2.03 mm
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 2.7 V 4.5 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES YES
Technology CMOS BICMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD
Terminal Form BALL NO LEAD
Terminal Pitch 0.8 mm 1.27 mm
Terminal Position BOTTOM QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 5.5 mm 8.89 mm
Base Number Matches 2 1
Additional Feature WITH DUAL OUTPUT ENABLE
Power Supply Current-Max (ICC) 72 mA

Compare IDT74LVCH32373ABF with alternatives

Compare SNJ54BCT541FK-00 with alternatives