IDT74LVCH16952APA vs QS74LVCH16952APAX feature comparison

IDT74LVCH16952APA Integrated Device Technology Inc

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QS74LVCH16952APAX Quality Semiconductor Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC QUALITY SEMICONDUCTOR INC
Part Package Code TSSOP
Package Description TSSOP, TSSOP56,.3,20 TSSOP, TSSOP56,.3,20
Pin Count 56
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION
Control Type INDEPENDENT CONTROL INDEPENDENT CONTROL
Count Direction BIDIRECTIONAL BIDIRECTIONAL
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G56 R-PDSO-G56
JESD-609 Code e0 e0
Length 14 mm
Logic IC Type REGISTERED BUS TRANSCEIVER REGISTERED BUS TRANSCEIVER
Max I(ol) 0.024 A 0.024 A
Moisture Sensitivity Level 1
Number of Bits 8 8
Number of Functions 2 2
Number of Ports 2 2
Number of Terminals 56 56
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP56,.3,20 TSSOP56,.3,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Peak Reflow Temperature (Cel) 240
Prop. Delay@Nom-Sup 6.6 ns 6.6 ns
Propagation Delay (tpd) 7.6 ns 7.6 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 20
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 6.1 mm
Base Number Matches 1 2
Packing Method TR

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