IDT74LVC574ASO vs TC74LCX574FW(ELP) feature comparison

IDT74LVC574ASO Integrated Device Technology Inc

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TC74LCX574FW(ELP) Toshiba America Electronic Components

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC TOSHIBA CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP20,.4 SOP, SOP20,.4
Pin Count 20 20
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e0 e0
Length 12.8 mm 12.8 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max Frequency@Nom-Sup 150000000 Hz 150000000 Hz
Max I(ol) 0.024 A 0.024 A
Moisture Sensitivity Level 1
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP20,.4 SOP20,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 225
Prop. Delay@Nom-Sup 7 ns 8.5 ns
Propagation Delay (tpd) 8 ns 8.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 2.7 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 20
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.5 mm 7.5 mm
Base Number Matches 1 1
Pbfree Code No
Additional Feature BROADSIDE VERSION OF 374
Packing Method TR

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