IDT74LVC16373APA8
vs
74LVC16373ADGG-T
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
NXP SEMICONDUCTORS
Part Package Code
TSSOP
TSSOP
Package Description
TSSOP, TSSOP48,.3,20
TSSOP,
Pin Count
48
48
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G48
R-PDSO-G48
JESD-609 Code
e0
e4
Length
12.5 mm
12.5 mm
Load Capacitance (CL)
50 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Max I(ol)
0.024 A
Moisture Sensitivity Level
1
1
Number of Bits
8
Number of Functions
2
2
Number of Ports
2
2
Number of Terminals
48
48
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Equivalence Code
TSSOP48,.3,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method
TR
Peak Reflow Temperature (Cel)
240
NOT SPECIFIED
Prop. Delay@Nom-Sup
4.2 ns
Propagation Delay (tpd)
5.3 ns
7 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
1.2 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
Tin/Lead (Sn85Pb15)
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
20
NOT SPECIFIED
Width
6.1 mm
6.1 mm
Base Number Matches
1
2
Pbfree Code
Compare IDT74LVC16373APA8 with alternatives
Compare 74LVC16373ADGG-T with alternatives