IDT74LVC16244APFG
vs
74LVCH32244AEC-T518
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOIC
|
|
| Package Description |
TSSOP,
|
LFBGA,
|
| Pin Count |
48
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
LVC/LCX/Z
|
LVC/LCX/Z
|
| JESD-30 Code |
R-PDSO-G48
|
R-PBGA-B96
|
| JESD-609 Code |
e3
|
|
| Length |
9.7 mm
|
13.5 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
4
|
4
|
| Number of Functions |
4
|
8
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
48
|
96
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
LFBGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Propagation Delay (tpd) |
4.7 ns
|
4.7 ns
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.2 mm
|
1.5 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
1.2 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
2.7 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.4 mm
|
0.8 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Width |
4.4 mm
|
5.5 mm
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare IDT74LVC16244APFG with alternatives
Compare 74LVCH32244AEC-T518 with alternatives