IDT74LVC162245APAG8
vs
74LVTH16245BDGG
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
PHILIPS SEMICONDUCTORS
Part Package Code
TSSOP
Package Description
TSSOP-48
TSSOP, TSSOP48,.3,20
Pin Count
48
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Date Of Intro
1999-03-25
Additional Feature
WITH DIRECTION CONTROL
Family
LVC/LCX/Z
JESD-30 Code
R-PDSO-G48
R-PDSO-G48
JESD-609 Code
e3
Length
12.5 mm
Logic IC Type
BUS TRANSCEIVER
Moisture Sensitivity Level
1
Number of Bits
8
8
Number of Functions
2
2
Number of Ports
2
Number of Terminals
48
48
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE WITH SERIES RESISTOR
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)
5.7 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Width
6.1 mm
Base Number Matches
2
3
Control Type
COMMON CONTROL
Count Direction
BIDIRECTIONAL
Load Capacitance (CL)
50 pF
Max I(ol)
0.064 A
Package Equivalence Code
TSSOP48,.3,20
Packing Method
TUBE
Prop. Delay@Nom-Sup
3.3 ns
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