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IDT74LVC11APY vs 74LVC11DB,112 feature comparison

IDT74LVC11APY Integrated Device Technology Inc

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74LVC11DB,112 NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC NXP SEMICONDUCTORS
Part Package Code SSOP SSOP1
Package Description SSOP, SSOP14,.3 5.30 MM, PLASTIC, MO-150, SOT-337-1, SSOP-14
Pin Count 14 14
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e0 e4
Length 6.2 mm 6.2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type AND GATE AND GATE
Max I(ol) 0.024 A 0.024 A
Number of Functions 3 3
Number of Inputs 3 3
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SSOP
Package Equivalence Code SSOP14,.3 SSOP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Prop. Delay@Nom-Sup 6.2 ns 7.2 ns
Propagation Delay (tpd) 7 ns 7 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 2 mm 2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.3 V 1.2 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 5.3 mm 5.3 mm
Base Number Matches 1 2
Manufacturer Package Code SOT337-1
Moisture Sensitivity Level 1
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Logic » Gates
Logic » Gates

Compare IDT74LVC11APY with alternatives

Compare 74LVC11DB,112 with alternatives