IDT74LVC112AQ8
vs
SN74LVC112APWTG4
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
TEXAS INSTRUMENTS INC
Part Package Code
SOIC
TSSOP
Package Description
SSOP,
TSSOP, TSSOP16,.25
Pin Count
16
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e0
e4
Length
4.9 mm
5 mm
Logic IC Type
J-K FLIP-FLOP
J-K FLIP-FLOP
Number of Bits
2
2
Number of Functions
2
2
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
TSSOP
Package Equivalence Code
SSOP16,.25
TSSOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)
7.1 ns
7.1 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
1.65 V
Supply Voltage-Nom (Vsup)
3.3 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
NICKEL PALLADIUM GOLD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.635 mm
0.65 mm
Terminal Position
DUAL
DUAL
Trigger Type
NEGATIVE EDGE
NEGATIVE EDGE
Width
3.9116 mm
4.4 mm
fmax-Min
150 MHz
150 MHz
Base Number Matches
1
1
Pbfree Code
Yes
Rohs Code
Yes
Load Capacitance (CL)
50 pF
Max Frequency@Nom-Sup
150000000 Hz
Max I(ol)
0.024 A
Moisture Sensitivity Level
1
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
5.9 ns
Time@Peak Reflow Temperature-Max (s)
30
Compare IDT74LVC112AQ8 with alternatives
Compare SN74LVC112APWTG4 with alternatives