IDT74LVC10APG8
vs
74LVC10APW,112
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
NXP SEMICONDUCTORS
Part Package Code
TSSOP
TSSOP
Package Description
TSSOP,
4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14
Pin Count
14
14
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
JESD-609 Code
e0
e4
Length
5 mm
5 mm
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
3
3
Number of Inputs
3
3
Number of Terminals
14
14
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)
5.8 ns
12.9 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.1 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.3 V
1.2 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
TIN LEAD
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
4.4 mm
4.4 mm
Base Number Matches
1
2
Manufacturer Package Code
SOT402-1
Factory Lead Time
4 Weeks
Load Capacitance (CL)
50 pF
Max I(ol)
0.024 A
Moisture Sensitivity Level
1
Package Equivalence Code
TSSOP14,.25
Packing Method
TUBE
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
5.7 ns
Schmitt Trigger
NO
Time@Peak Reflow Temperature-Max (s)
30
Compare IDT74LVC10APG8 with alternatives
Compare 74LVC10APW,112 with alternatives