IDT74FST163211PA8 vs CBTD16211DGG-T feature comparison

IDT74FST163211PA8 Integrated Device Technology Inc

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CBTD16211DGG-T NXP Semiconductors

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC NXP SEMICONDUCTORS
Part Package Code TSSOP TSSOP
Package Description TSSOP, TSSOP56,.3,20 TSSOP,
Pin Count 56 56
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature TTL COMPATIBLE BUS SWITCH
Family CBT/FST/QS/5C/B CBT/FST/QS/5C/B
JESD-30 Code R-PDSO-G56 R-PDSO-G56
JESD-609 Code e0
Length 14 mm 14 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Moisture Sensitivity Level 1
Number of Bits 12 12
Number of Functions 2 2
Number of Ports 2 2
Number of Terminals 56 56
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP56,.3,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 240
Propagation Delay (tpd) 0.25 ns 0.25 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 20
Width 6.1 mm 6.1 mm
Base Number Matches 1 1

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Compare CBTD16211DGG-T with alternatives