IDT74FCT573TE
vs
CY74FCT2573ATQCT
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
DFP
|
QSOP
|
| Package Description |
DFP,
|
QSOP-20
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
BROADSIDE VERSION OF 373
|
|
| Family |
FCT
|
FCT
|
| JESD-30 Code |
R-GDFP-F20
|
R-PDSO-G20
|
| JESD-609 Code |
e0
|
e4
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
8
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE WITH SERIES RESISTOR
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DFP
|
SSOP
|
| Package Equivalence Code |
FL20,.3
|
SSOP20,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
SMALL OUTLINE, SHRINK PITCH
|
| Propagation Delay (tpd) |
13 ns
|
8.5 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.3368 mm
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
FLAT
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.635 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
6.9215 mm
|
3.9 mm
|
| Base Number Matches |
1
|
3
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| ECCN Code |
|
EAR99
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| Control Type |
|
ENABLE LOW/HIGH
|
| Count Direction |
|
UNIDIRECTIONAL
|
| Length |
|
8.65 mm
|
| Max I(ol) |
|
0.012 A
|
| Moisture Sensitivity Level |
|
2
|
| Packing Method |
|
TR
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Power Supply Current-Max (ICC) |
|
0.2 mA
|
| Prop. Delay@Nom-Sup |
|
5.2 ns
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare IDT74FCT573TE with alternatives
Compare CY74FCT2573ATQCT with alternatives