IDT74FCT257ATP
vs
CY74FCT257ATPC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
DIP
DIP
Package Description
DIP, DIP16,.3
DIP, DIP16,.3
Pin Count
16
16
Reach Compliance Code
not_compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
FCT
FCT
JESD-30 Code
R-PDIP-T16
R-PDIP-T16
JESD-609 Code
e0
e0
Length
19.1135 mm
19.177 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Max I(ol)
0.048 A
0.064 A
Moisture Sensitivity Level
1
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
240
Prop. Delay@Nom-Sup
5 ns
5 ns
Propagation Delay (tpd)
5 ns
7 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.191 mm
4.826 mm
Supply Voltage-Max (Vsup)
5.25 V
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
20
Width
7.62 mm
7.62 mm
Base Number Matches
1
1
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