IDT74FCT2573TE
vs
IDT54FCT573TEB
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
DFP
|
DFP
|
| Package Description |
DFP,
|
DFP, FL20,.3
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
BROADSIDE VERSION OF 2373
|
BROADSIDE VERSION OF 373
|
| Family |
FCT
|
FCT
|
| JESD-30 Code |
R-GDFP-F20
|
R-GDFP-F20
|
| JESD-609 Code |
e0
|
e0
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output Characteristics |
3-STATE WITH SERIES RESISTOR
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DFP
|
DFP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Propagation Delay (tpd) |
13 ns
|
15 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.337 mm
|
2.337 mm
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
6.9215 mm
|
6.9215 mm
|
| Base Number Matches |
1
|
1
|
| Max I(ol) |
|
0.032 A
|
| Package Equivalence Code |
|
FL20,.3
|
| Prop. Delay@Nom-Sup |
|
8.5 ns
|
| Screening Level |
|
MIL-STD-883 Class B
|
|
|
|
Compare IDT74FCT2573TE with alternatives
Compare IDT54FCT573TEB with alternatives