IDT74FCT162H245TPAT/R vs CY74FCT162H245TPAC feature comparison

IDT74FCT162H245TPAT/R Integrated Device Technology Inc

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CY74FCT162H245TPAC Cypress Semiconductor

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC CYPRESS SEMICONDUCTOR CORP
Part Package Code TSSOP TSSOP
Package Description TSSOP, TSSOP, TSSOP48,.3,20
Pin Count 48 48
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature WITH DIRECTION CONTROL WITH DIRECTION CONTROL
Family FCT FCT
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e0 e0
Length 12.5 mm 12.5 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUS TRANSCEIVER BUS TRANSCEIVER
Moisture Sensitivity Level 1 1
Number of Bits 8 8
Number of Functions 2 2
Number of Ports 2 2
Number of Terminals 48 48
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE WITH SERIES RESISTOR 3-STATE WITH SERIES RESISTOR
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 240 NOT SPECIFIED
Propagation Delay (tpd) 7 ns 7 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 6.1 mm 6.1 mm
Base Number Matches 1 1
Control Type COMMON CONTROL
Count Direction BIDIRECTIONAL
Max I(ol) 0.024 A
Package Equivalence Code TSSOP48,.3,20
Prop. Delay@Nom-Sup 7 ns

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