IDT74CBTLVR3384PG vs IDT74CBTLVR3384PY feature comparison

IDT74CBTLVR3384PG Integrated Device Technology Inc

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IDT74CBTLVR3384PY Integrated Device Technology Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code TSSOP SSOP
Package Description TSSOP, TSSOP24,.25 SSOP-24
Pin Count 24 24
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family CBTLV/3B CBTLV/3B
JESD-30 Code R-PDSO-G24 R-PDSO-G24
JESD-609 Code e0 e0
Length 7.8 mm 8.2 mm
Logic IC Type BUS DRIVER BUS DRIVER
Moisture Sensitivity Level 1
Number of Bits 10 10
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 24 24
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SSOP
Package Equivalence Code TSSOP24,.25 SSOP24,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel) 240
Propagation Delay (tpd) 1.5 ns 1.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.3 V 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 20
Width 4.4 mm 5.3 mm
Base Number Matches 3 3

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