IDT74CBTLV3861PGG vs IDT74CBTLV3861P feature comparison

IDT74CBTLV3861PGG Renesas Electronics Corporation

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IDT74CBTLV3861P Integrated Device Technology Inc

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Rohs Code Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer RENESAS ELECTRONICS CORP INTEGRATED DEVICE TECHNOLOGY INC
Package Description TSSOP, TSSOP24,.25 TSSOP-24
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family CBTLV/3B CBTLV/3B
JESD-30 Code R-PDSO-G24 R-PDSO-G24
JESD-609 Code e3 e0
Length 7.8 mm 7.8 mm
Logic IC Type BUS DRIVER BUS DRIVER
Moisture Sensitivity Level 1
Number of Bits 10 10
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 24 24
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP24,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 0.25 ns 0.25 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.3 V 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Matte Tin (Sn) - annealed TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 4.4 mm 4.4 mm
Base Number Matches 2 2
Part Package Code TSSOP
Pin Count 24

Compare IDT74CBTLV3861PGG with alternatives

Compare IDT74CBTLV3861P with alternatives