IDT74CBTLV3384PGG8
vs
CYBUS3384QC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
TSSOP
SOIC
Package Description
TSSOP-24
0.150 INCH, QSOP-24
Pin Count
24
24
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
CBTLV/3B
JESD-30 Code
R-PDSO-G24
R-PDSO-G24
JESD-609 Code
e3
e0
Length
7.8 mm
8.65 mm
Logic IC Type
BUS DRIVER
BUS DRIVER
Moisture Sensitivity Level
1
Number of Bits
10
5
Number of Functions
1
2
Number of Ports
2
2
Number of Terminals
24
24
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
SSOP
Package Equivalence Code
TSSOP24,.25
SSOP24,.24
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
0.25 ns
0.25 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.75 mm
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
2.3 V
4 V
Supply Voltage-Nom (Vsup)
2.5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn) - annealed
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.635 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
4.4 mm
3.9 mm
Base Number Matches
1
2
Additional Feature
TTL COMPATIBLE BUS SWITCH
Load Capacitance (CL)
50 pF
Compare IDT74CBTLV3384PGG8 with alternatives
Compare CYBUS3384QC with alternatives