IDT74CBTLV3126PG
vs
IDT74CBTLV3126Q
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
TSSOP
SOIC
Package Description
TSSOP, TSSOP14,.25
SSOP, SSOP16,.25
Pin Count
14
16
Reach Compliance Code
not_compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
CBTLV/3B
CBTLV/3B
JESD-30 Code
R-PDSO-G14
R-PDSO-G16
JESD-609 Code
e0
e0
Length
5 mm
4.9022 mm
Logic IC Type
BUS DRIVER
BUS DRIVER
Moisture Sensitivity Level
1
1
Number of Bits
4
4
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
14
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
SSOP
Package Equivalence Code
TSSOP14,.25
SSOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel)
240
240
Propagation Delay (tpd)
0.25 ns
0.25 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.7272 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.3 V
2.3 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn85Pb15)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.635 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
20
Width
4.4 mm
3.9116 mm
Base Number Matches
1
1
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