IDT74CBTLV16212PV
vs
935270186118
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
NXP SEMICONDUCTORS
Part Package Code
SSOP
TSSOP
Package Description
SSOP, SSOP56,.4
TSSOP,
Pin Count
56
56
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
CBTLV/3B
CBT/FST/Q
JESD-30 Code
R-PDSO-G56
R-PDSO-G56
JESD-609 Code
e0
Length
18.415 mm
14 mm
Logic IC Type
BUS EXCHANGER
BUS EXCHANGER
Moisture Sensitivity Level
1
Number of Bits
2
2
Number of Functions
12
12
Number of Ports
4
4
Number of Terminals
56
56
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
TSSOP
Package Equivalence Code
SSOP56,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
225
NOT SPECIFIED
Propagation Delay (tpd)
0.25 ns
0.25 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.794 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
2.3 V
4.5 V
Supply Voltage-Nom (Vsup)
2.5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.635 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
20
NOT SPECIFIED
Width
7.5 mm
6.1 mm
Base Number Matches
1
1
Compare IDT74CBTLV16212PV with alternatives
Compare 935270186118 with alternatives