IDT74CBTLV16212PFG
vs
74CBTLV16212PF
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
SSOP
|
|
Package Description |
TSSOP,
|
SOP, TSSOP56,.25,16
|
Pin Count |
56
|
|
Reach Compliance Code |
compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
CBTLV/3B
|
CBTLV/3B
|
JESD-30 Code |
R-PDSO-G56
|
R-PDSO-G56
|
JESD-609 Code |
e3
|
e0
|
Length |
11.3 mm
|
|
Logic IC Type |
BUS EXCHANGER
|
BUS EXCHANGER
|
Moisture Sensitivity Level |
1
|
1
|
Number of Bits |
2
|
12
|
Number of Functions |
12
|
1
|
Number of Ports |
4
|
4
|
Number of Terminals |
56
|
56
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
SOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
240
|
Propagation Delay (tpd) |
0.25 ns
|
0.25 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
2.3 V
|
2.3 V
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
Tin/Lead (Sn85Pb15)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.4 mm
|
0.4 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
Width |
4.4 mm
|
|
Base Number Matches |
1
|
1
|
Package Equivalence Code |
|
TSSOP56,.25,16
|
|
|
|
Compare IDT74CBTLV16212PFG with alternatives
Compare 74CBTLV16212PF with alternatives