IDT74AUC32245BFI8 vs 74AUC32245BFI feature comparison

IDT74AUC32245BFI8 Integrated Device Technology Inc

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74AUC32245BFI Integrated Device Technology Inc

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA
Package Description LFBGA-96 LFBGA-96
Pin Count 96
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Control Type COMMON CONTROL COMMON CONTROL
Count Direction BIDIRECTIONAL BIDIRECTIONAL
Family AUC CBT/FST/QS/5C/B
JESD-30 Code R-PBGA-B96 R-PBGA-B96
JESD-609 Code e0 e0
Length 13.5 mm 13.5 mm
Load Capacitance (CL) 15 pF 15 pF
Logic IC Type BUS TRANSCEIVER BUS TRANSCEIVER
Max I(ol) 0.0001 A 0.0001 A
Moisture Sensitivity Level 3 3
Number of Bits 1 8
Number of Functions 32 4
Number of Ports 2 2
Number of Terminals 96 96
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA96,6X16,32 BGA96,6X16,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 225 225
Prop. Delay@Nom-Sup 3.1 ns 3.1 ns
Propagation Delay (tpd) 3.1 ns 3.1 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 1.5 mm
Supply Voltage-Max (Vsup) 2.7 V 2.7 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.8 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 5.5 mm 5.5 mm
Base Number Matches 1 1
Pbfree Code No