IDT74AUC164245BVI8
vs
IDT74AUC16245BVGI
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
VFBGA-56
|
TFBGA,
|
| Pin Count |
56
|
48
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Control Type |
COMMON CONTROL
|
|
| Count Direction |
BIDIRECTIONAL
|
|
| Family |
AUC
|
AUC
|
| JESD-30 Code |
R-PBGA-B56
|
R-PBGA-B48
|
| JESD-609 Code |
e0
|
e1
|
| Length |
7 mm
|
7 mm
|
| Logic IC Type |
BUS TRANSCEIVER
|
BUS TRANSCEIVER
|
| Max I(ol) |
0.0001 A
|
|
| Number of Bits |
8
|
8
|
| Number of Functions |
2
|
2
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
56
|
48
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
TFBGA
|
| Package Equivalence Code |
BGA56,6X10,25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Packing Method |
TR
|
|
| Propagation Delay (tpd) |
4.5 ns
|
3.1 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.05 mm
|
1.05 mm
|
| Supply Voltage-Max (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Min (Vsup) |
0.8 V
|
0.8 V
|
| Supply Voltage-Nom (Vsup) |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
4.5 mm
|
4.5 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
|
|
|
Compare IDT74AUC164245BVI8 with alternatives
Compare IDT74AUC16245BVGI with alternatives