IDT74AUC16373PFGI
vs
SN74AUC16374GQLR
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
TEXAS INSTRUMENTS INC
Part Package Code
SOIC
BGA
Package Description
TSSOP,
VFBGA, BGA56,6X10,25
Pin Count
48
56
Reach Compliance Code
compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
AUC
AUC
JESD-30 Code
R-PDSO-G48
R-PBGA-B56
JESD-609 Code
e3
Length
9.7 mm
7 mm
Logic IC Type
BUS DRIVER
BUS DRIVER
Moisture Sensitivity Level
1
Number of Bits
8
8
Number of Functions
2
2
Number of Ports
2
2
Number of Terminals
48
56
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
VFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Propagation Delay (tpd)
4.9 ns
4.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1 mm
Supply Voltage-Max (Vsup)
2.7 V
2.7 V
Supply Voltage-Min (Vsup)
0.8 V
0.8 V
Supply Voltage-Nom (Vsup)
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
Terminal Form
GULL WING
BALL
Terminal Pitch
0.4 mm
0.65 mm
Terminal Position
DUAL
BOTTOM
Width
4.4 mm
4.5 mm
Base Number Matches
1
1
Load Capacitance (CL)
15 pF
Max Frequency@Nom-Sup
250000000 Hz
Max I(ol)
0.005 A
Package Equivalence Code
BGA56,6X10,25
Packing Method
TR
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Prop. Delay@Nom-Sup
4.5 ns
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Trigger Type
POSITIVE EDGE
Compare IDT74AUC16373PFGI with alternatives
Compare SN74AUC16374GQLR with alternatives