IDT74AUC16245PAI8
vs
74ALVCH32973ZKER
feature comparison
All Stats
Differences Only
Rohs Code
No
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
TEXAS INSTRUMENTS INC
Part Package Code
TSSOP
BGA
Package Description
TSSOP-48
LFBGA-96
Pin Count
48
96
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Control Type
COMMON CONTROL
COMMON CONTROL
Count Direction
BIDIRECTIONAL
BIDIRECTIONAL
Family
AUC
ALVC/VCX/A
JESD-30 Code
R-PDSO-G48
R-PBGA-B96
JESD-609 Code
e0
e1
Length
12.5 mm
13.5 mm
Logic IC Type
BUS TRANSCEIVER
BUS TRANSCEIVER
Max I(ol)
0.0001 A
0.024 A
Moisture Sensitivity Level
1
3
Number of Bits
8
8
Number of Functions
2
2
Number of Ports
2
2
Number of Terminals
48
96
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
LFBGA
Package Equivalence Code
TSSOP48,.3,20
BGA96,6X16,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Packing Method
TR
TR
Peak Reflow Temperature (Cel)
240
260
Propagation Delay (tpd)
3.1 ns
3.3 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
1.4 mm
Supply Voltage-Max (Vsup)
2.7 V
3.6 V
Supply Voltage-Min (Vsup)
0.8 V
1.65 V
Supply Voltage-Nom (Vsup)
1.2 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
0.8 mm
Terminal Position
DUAL
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
30
Width
6.1 mm
5.5 mm
Base Number Matches
1
1
Pbfree Code
Yes
ECCN Code
EAR99
Samacsys Manufacturer
Texas Instruments
Power Supply Current-Max (ICC)
0.06 mA
Prop. Delay@Nom-Sup
3 ns
Compare IDT74AUC16245PAI8 with alternatives
Compare 74ALVCH32973ZKER with alternatives