IDT74AUC16240BVI vs SN74AUC16244ZQLR feature comparison

IDT74AUC16240BVI Integrated Device Technology Inc

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SN74AUC16244ZQLR Texas Instruments

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC TEXAS INSTRUMENTS INC
Part Package Code BGA BGA
Package Description TFBGA, BGA56,6X10,25 BGA-56
Pin Count 56 56
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Control Type ENABLE LOW ENABLE LOW
Family AUC AUC
JESD-30 Code R-PBGA-B56 R-PBGA-B56
JESD-609 Code e0 e1
Length 7 mm 7 mm
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.0001 A 0.009 A
Number of Bits 4 4
Number of Functions 4 4
Number of Ports 4 2
Number of Terminals 56 56
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity INVERTED TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA VFBGA
Package Equivalence Code BGA56,6X10,25 BGA56,6X10,25
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Propagation Delay (tpd) 2.6 ns 2.8 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.05 mm 1 mm
Supply Voltage-Max (Vsup) 2.7 V 2.7 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.8 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position BOTTOM BOTTOM
Width 4.5 mm 4.5 mm
Base Number Matches 1 1
ECCN Code EAR99
Count Direction UNIDIRECTIONAL
Load Capacitance (CL) 15 pF
Moisture Sensitivity Level 1
Packing Method TR
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 0.02 mA
Prop. Delay@Nom-Sup 2.8 ns
Time@Peak Reflow Temperature-Max (s) 30

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