IDT74ALVCH16374PFG vs 74LVC16374ABX,518 feature comparison

IDT74ALVCH16374PFG Integrated Device Technology Inc

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74LVC16374ABX,518 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC NXP SEMICONDUCTORS
Part Package Code SOIC QFN
Package Description TSSOP, HVBCC, LGA60,8X12,20
Pin Count 48 QFN
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family ALVC/VCX/A LVC/LCX/Z
JESD-30 Code R-PDSO-G48 R-PBCC-B60
JESD-609 Code e3 e3
Length 9.7 mm 6 mm
Logic IC Type BUS DRIVER BUS DRIVER
Moisture Sensitivity Level 1 2
Number of Bits 8 8
Number of Functions 2 2
Number of Ports 2 2
Number of Terminals 48 60
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP HVBCC
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Propagation Delay (tpd) 4.9 ns 7.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 0.5 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 1.65 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish MATTE TIN MATTE TIN
Terminal Form GULL WING BUTT
Terminal Pitch 0.4 mm 0.5 mm
Terminal Position DUAL BOTTOM
Width 4.4 mm 4 mm
Base Number Matches 1 2
Manufacturer Package Code SOT1134-2
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 100000000 Hz
Max I(ol) 0.024 A
Package Equivalence Code LGA60,8X12,20
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 7 ns
Time@Peak Reflow Temperature-Max (s) 30
Trigger Type POSITIVE EDGE

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Compare 74LVC16374ABX,518 with alternatives