IDT74ALVCF162835APF
vs
IDT74ALVCF162835PF8
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
SSOP
|
SSOP
|
Package Description |
TSSOP, TSSOP56,.25,16
|
0.40 MM PITCH, TVSOP-56
|
Pin Count |
56
|
56
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
ALVC/VCX/A
|
ALVC/VCX/A
|
JESD-30 Code |
R-PDSO-G56
|
R-PDSO-G56
|
JESD-609 Code |
e0
|
e0
|
Length |
11.3 mm
|
11.3 mm
|
Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
Moisture Sensitivity Level |
1
|
1
|
Number of Bits |
18
|
18
|
Number of Functions |
1
|
1
|
Number of Ports |
2
|
2
|
Number of Terminals |
56
|
56
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
3-STATE WITH SERIES RESISTOR
|
3-STATE WITH SERIES RESISTOR
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Equivalence Code |
TSSOP56,.25,16
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
240
|
240
|
Propagation Delay (tpd) |
5.6 ns
|
5.9 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
2.3 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.4 mm
|
0.4 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
4.4 mm
|
4.4 mm
|
Base Number Matches |
1
|
2
|
|
|
|
Compare IDT74ALVCF162835APF with alternatives
Compare IDT74ALVCF162835PF8 with alternatives