IDT74ALVC162835APA
vs
HD74ALVC162835AT-EL
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
HITACHI LTD
Part Package Code
TSSOP
TSSOP
Package Description
TSSOP, TSSOP56,.3,20
TSSOP, TSSOP56,.3,20
Pin Count
56
56
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Control Type
ENABLE LOW
ENABLE LOW
Family
ALVC/VCX/A
ALVC/VCX/A
JESD-30 Code
R-PDSO-G56
R-PDSO-G56
JESD-609 Code
e0
Length
14 mm
14 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Max I(ol)
0.012 A
0.012 A
Moisture Sensitivity Level
1
Number of Bits
18
18
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
56
56
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE WITH SERIES RESISTOR
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Equivalence Code
TSSOP56,.3,20
TSSOP56,.3,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
240
Prop. Delay@Nom-Sup
3.5 ns
5.4 ns
Propagation Delay (tpd)
5.9 ns
6.3 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.3 V
2.3 V
Supply Voltage-Nom (Vsup)
3.3 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn85Pb15)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
20
Width
6.1 mm
6.1 mm
Base Number Matches
1
2
Packing Method
TR
Compare IDT74ALVC162835APA with alternatives
Compare HD74ALVC162835AT-EL with alternatives