IDT73720APQF vs IDT73720J feature comparison

IDT73720APQF Integrated Device Technology Inc

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IDT73720J Integrated Device Technology Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP LCC
Package Description PLASTIC, QFP-80 PLASTIC, LCC-68
Pin Count 80 68
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature BYTE CONTROL ON ALL THREE PORTS BYTE CONTROL ON ALL THREE PORTS
Family 73 73
JESD-30 Code S-PQFP-G80 S-PQCC-J68
JESD-609 Code e0 e0
Length 14 mm 24.2062 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUS EXCHANGER BUS EXCHANGER
Number of Bits 16 16
Number of Functions 1 1
Number of Ports 3 3
Number of Terminals 80 68
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP QCCJ
Package Equivalence Code QFP80,.7SQ LDCC68,1.0SQ
Package Shape SQUARE SQUARE
Package Style FLATPACK CHIP CARRIER
Propagation Delay (tpd) 7 ns 8.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.45 mm 4.57 mm
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form GULL WING J BEND
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position QUAD QUAD
Width 14 mm 24.2062 mm
Base Number Matches 3 2
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 20

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