IDT73720AJ vs IDT73720PQF8 feature comparison

IDT73720AJ Integrated Device Technology Inc

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IDT73720PQF8 Integrated Device Technology Inc

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code LCC QFP
Package Description PLASTIC, LCC-68 QFP,
Pin Count 68 80
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature BYTE CONTROL ON ALL THREE PORTS BYTE CONTROL ON ALL THREE PORTS
Family 73 73
JESD-30 Code S-PQCC-J68 S-PQFP-G80
JESD-609 Code e0 e0
Length 24.2062 mm 14 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUS EXCHANGER BUS EXCHANGER
Moisture Sensitivity Level 1
Number of Bits 16 16
Number of Functions 1 1
Number of Ports 3 3
Number of Terminals 68 80
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QFP
Package Equivalence Code LDCC68,1.0SQ QFP80,.7SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER FLATPACK
Peak Reflow Temperature (Cel) 225
Propagation Delay (tpd) 7 ns 8.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 2.45 mm
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form J BEND GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 20
Width 24.2062 mm 14 mm
Base Number Matches 1 1

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Compare IDT73720PQF8 with alternatives