IDT72V90823BCG vs IDT72V70820PF feature comparison

IDT72V90823BCG Integrated Device Technology Inc

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IDT72V70820PF Integrated Device Technology Inc

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA QFP
Package Description 11 X 11 MM, 1 MM PITCH, BGA-100 LFQFP,
Pin Count 100 100
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B100 S-PQFP-G100
JESD-609 Code e1 e0
Length 11 mm 14 mm
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 100 100
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LFQFP
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE FLATPACK, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 1.6 mm
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Telecom IC Type DIGITAL TIME SWITCH DIGITAL TIME SWITCH
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER Tin/Lead (Sn/Pb)
Terminal Form BALL GULL WING
Terminal Pitch 1 mm 0.5 mm
Terminal Position BOTTOM QUAD
Width 11 mm 14 mm
Base Number Matches 1 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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