IDT72V73273DR8 vs IDT72V71660BB feature comparison

IDT72V73273DR8 Integrated Device Technology Inc

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IDT72V71660BB Integrated Device Technology Inc

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP BGA
Package Description FQFP, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-208
Pin Count 208 208
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PQFP-G208 S-PBGA-B208
Length 28 mm 17 mm
Number of Functions 1 1
Number of Terminals 208 208
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FQFP BGA
Package Shape SQUARE SQUARE
Package Style FLATPACK, FINE PITCH GRID ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.1 mm 1.97 mm
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Telecom IC Type DIGITAL TIME SWITCH DIGITAL TIME SWITCH
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 1 mm
Terminal Position QUAD BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 28 mm 17 mm
Base Number Matches 1 1
Pbfree Code No
JESD-609 Code e0
Moisture Sensitivity Level 3
Package Equivalence Code BGA208,16X16,40
Supply Current-Max 0.32 mA
Terminal Finish TIN LEAD

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