IDT72V73273BBG
vs
IDT72V73273DR
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
QFP
Package Description
17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-208
28 X 28 MM, 0.50 MM PITCH, PLASTIC, QFP-208
Pin Count
208
208
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B208
S-PQFP-G208
JESD-609 Code
e1
e0
Length
17 mm
28 mm
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
208
208
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
FQFP
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
FLATPACK, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.97 mm
4.1 mm
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Telecom IC Type
DIGITAL TIME SWITCH
DIGITAL TIME SWITCH
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Width
17 mm
28 mm
Base Number Matches
1
4
Package Equivalence Code
QFP208,1.2SQ,20
Supply Current-Max
0.38 mA
Compare IDT72V73273BBG with alternatives
Compare IDT72V73273DR with alternatives