IDT72V73260DA
vs
72V71643BC8
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
QFP
|
BGA
|
| Package Description |
20 X 20 MM, 0.50 MM PITCH, TQFP-144
|
13 X 13 MM, 1 MM PITCH, BGA-144
|
| Pin Count |
144
|
144
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PQFP-G144
|
S-PBGA-B144
|
| JESD-609 Code |
e0
|
e0
|
| Length |
20 mm
|
13 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
144
|
144
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
LBGA
|
| Package Equivalence Code |
QFP144,.87SQ,20
|
BGA144,12X12,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE
|
| Peak Reflow Temperature (Cel) |
240
|
225
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
1.5 mm
|
| Supply Current-Max |
0.64 mA
|
0.075 mA
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
DIGITAL TIME SWITCH
|
DIGITAL TIME SWITCH
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.5 mm
|
1 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
20
|
| Width |
20 mm
|
13 mm
|
| Base Number Matches |
4
|
2
|
|
|
|
Compare IDT72V73260DA with alternatives
Compare 72V71643BC8 with alternatives