We use Cookies to give you best experience on our website. By using our website and services, you expressly agree to the placement of our performance, functionality and advertising cookies. Please see our Privacy Policy for more information.

Register or Sign In

IDT72V51456L7-5BB8 vs 72V51256L7-5BB8 feature comparison

IDT72V51456L7-5BB8 Integrated Device Technology Inc

Buy Now Datasheet

72V51256L7-5BB8 Renesas Electronics Corporation

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC RENESAS ELECTRONICS CORP
Part Package Code BGA PBGA
Package Description BGA, BGA256,16X16,40 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256
Pin Count 256 256
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 NLR
HTS Code 8542.32.00.71 8542320071
Access Time-Max 4 ns 4 ns
Additional Feature ALTERNATIVE MEMORY WIDTH:9-BIT AND 18-BIT ALTERNATIVE MEMORY WIDTH:9-BIT AND 18-BIT
Clock Frequency-Max (fCLK) 133 MHz 133 MHz
Cycle Time 7.5 ns 7.5 ns
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e0
Length 17 mm 17 mm
Memory Density 2359296 bit 2359296 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 36 36
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 256 256
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 64KX36 64KX36
Output Enable YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 3.5 mm
Standby Current-Max 0.01 A 0.01 A
Supply Current-Max 0.1 mA 0.1 mA
Supply Voltage-Max (Vsup) 3.45 V 3.45 V
Supply Voltage-Min (Vsup) 3.15 V 3.15 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 17 mm 17 mm
Base Number Matches 1 1
Manufacturer Package Code BB256
Samacsys Manufacturer Renesas Electronics
Memory » FIFOs
Memory » FIFOs

Compare IDT72V51456L7-5BB8 with alternatives

Compare 72V51256L7-5BB8 with alternatives