IDT72V51336L6BBG8
vs
IDT72V51336L6BB
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
BGA,
BGA, BGA256,16X16,40
Pin Count
256
256
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
3.7 ns
3.7 ns
Additional Feature
ALTERNATIVE MEMORY WIDTH:9-BIT AND 18-BIT
ALTERNATIVE MEMORY WIDTH:9-BIT AND 18-BIT
Cycle Time
6 ns
6 ns
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e1
e0
Length
17 mm
17 mm
Memory Density
589824 bit
589824 bit
Memory Width
36
36
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
256
256
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
16KX36
16KX36
Output Enable
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
225
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.5 mm
3.5 mm
Supply Voltage-Max (Vsup)
3.45 V
3.45 V
Supply Voltage-Min (Vsup)
3.15 V
3.15 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
30
Width
17 mm
17 mm
Base Number Matches
1
1
Clock Frequency-Max (fCLK)
166 MHz
Memory IC Type
OTHER FIFO
Package Equivalence Code
BGA256,16X16,40
Standby Current-Max
0.01 A
Supply Current-Max
0.1 mA
Compare IDT72V51336L6BBG8 with alternatives
Compare IDT72V51336L6BB with alternatives