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IDT72V3672L10PF9 vs IDT72V3672L10PFG8 feature comparison

IDT72V3672L10PF9 Integrated Device Technology Inc

Buy Now Datasheet

IDT72V3672L10PFG8 Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP QFP
Package Description TQFP-120 LFQFP,
Pin Count 120 120
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Total Weight 699.4 699.4
Category CO2 Kg 12.3 12.3
CO2 8602.62 8602.62
Compliance Temperature Grade Commercial: +0C to +70C Commercial: +0C to +70C
Candidate List Date 2024-01-23 2021-01-19
SVHC Over MCV 7439-92-1
CAS Accounted for Wt 92 92
CA Prop 65 Presence YES
CA Prop 65 CAS Numbers 7439-92-1
Conflict Mineral Status DRC Conflict Free DRC Conflict Free
Conflict Mineral Status Source CMRT V3.02 CMRT V6.01
Access Time-Max 6.5 ns 6.5 ns
Additional Feature MAIL BOX BYPASS REGISTER MAIL BOX BYPASS REGISTER
Cycle Time 10 ns 10 ns
JESD-30 Code S-PQFP-G120 S-PQFP-G120
JESD-609 Code e0 e3
Length 14 mm 14 mm
Memory Density 294912 bit 294912 bit
Memory IC Type BI-DIRECTIONAL FIFO
Memory Width 36 36
Moisture Sensitivity Level 4 3
Number of Functions 1 1
Number of Terminals 120 120
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 8KX36 8KX36
Output Enable YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP LFQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.6 mm
Supply Current-Max 0.4 mA
Supply Voltage-Max (Vsup) 3.45 V 3.45 V
Supply Voltage-Min (Vsup) 3.15 V 3.15 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.4 mm 0.4 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 40
Width 14 mm 14 mm
Base Number Matches 1 1
EU RoHS Version RoHS 2 (2015/863/EU)
EFUP e
Memory » FIFOs
Memory » FIFOs

Compare IDT72V3672L10PF9 with alternatives

Compare IDT72V3672L10PFG8 with alternatives