IDT72V264L10PF
vs
72V264L10PF
feature comparison
All Stats
Differences Only
Pbfree Code
No
No
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFP
Package Description
LQFP, QFP64,.66SQ,32
QFP, QFP64,.66SQ,32
Pin Count
64
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
8 ns
8 ns
Additional Feature
CAN ALSO BE CONFIGURED AS 8K X 18
Alternate Memory Width
9
9
Clock Frequency-Max (fCLK)
100 MHz
100 MHz
Cycle Time
10 ns
JESD-30 Code
S-PQFP-G64
S-PQFP-G64
JESD-609 Code
e0
e0
Length
14 mm
Memory Density
147456 bit
147456 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
9
18
Moisture Sensitivity Level
3
3
Number of Functions
1
Number of Terminals
64
64
Number of Words
16384 words
8192 words
Number of Words Code
16000
8000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
16KX9
8KX18
Output Enable
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
QFP
Package Equivalence Code
QFP64,.66SQ,32
QFP64,.66SQ,32
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE
FLATPACK
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
240
240
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
Supply Current-Max
0.11 mA
0.11 mA
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Width
14 mm
Base Number Matches
1
1
Compare IDT72V264L10PF with alternatives
Compare 72V264L10PF with alternatives